GM-1100
- Intel® Core™ i9/i7/i5/i3 Prozessoren der 14/13/12 Generation (max. 65 W TDP)
- Unterstützt 1x MXM 3.1 Typ A/B Formfaktor GPU-Modulerweiterung.
- 1x 2.5GbE LAN, 1x 20Gbps USB3.2 Gen2 x2, Typ-C Anschluss
- 1x M.2 Key M Typ 2280 Sockel für PCIe Gen4x4 NVMe-Speicher
- 1x M.2 Key E Typ 2230 Sockel für Wireless / Intel CNVi Modulerweiterung
- 1x M.2 Key B Typ 3052/3042 Sockel für 5G / Speicher / Erweiterungskarten
- 2x M.2 Key B Typ 2242 Sockel für Speicher / Erweiterungskarten
- Optionale CMI- & CFM-Module für I/O-Erweiterung & Zündfunktions-Erkennung
- Breiter Betriebstemperaturbereich von -40°C bis 70°C
Der GM-1100 ist ein kompakter und robuster Embedded-MXM-GPU-Computer für hohe Rechenleistung. Er kombiniert leistungsstarke Rechen- und Grafikverarbeitungsfunktionen mit hochflexiblen Erweiterungsmöglichkeiten, was ihn ideal für Edge-AI-Anwendungen mit begrenztem Installationsplatz macht.
3-fache Leistungssteigerung
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Ausgestattet mit einem Intel® Core-Prozessor der 14. Generation (Raptor Lake-S Refresh) erreicht der GM-1100 die dreifache Rechenleistung seines Vorgängers. Für hochkomplexe oder spezialisierte Aufgaben kann zwischen der Hybrid- oder der monolithischen P-Core-Architektur gewählt werden, um die bestmögliche Leistung entsprechend den spezifischen Anforderungen zu erzielen.
MXM-GPU-Modul
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MXM-GPU-Module vom Typ A und B bieten umfassende Optionen für leichte oder leistungsstarke KI-Inferenzanwendungen. Das spezielle modulare Design ermöglicht zudem mühelose Upgrades auf höherwertige MXM-Module, um die Leistung in Zukunft zu steigern.
Hochgeschwindigkeitsverbindungen und Datenspeicher
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Native 2,5-GbE-LAN- und 20Gbps USB 3.2 Gen2x2 Type-C Hochgeschwindigkeitsverbindungen verbessern die Effizienz bei der Übertragung von Bildern und Dateien erheblich. Zu den Speicheroptionen gehören zwei 2,5”-HDD/SSD-Einschübe sowie Optionen für Hochgeschwindigkeits-NVMe-SSD-Speicher.
Ideal für Mobilität Anwendungen
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Das kompakte Format (260 x 200 x 85 mm), mehrere M.2-Erweiterungssteckplätze für 5G- oder Wi-Fi-Kommunikationsmodule sowie die Einhaltung der Bahnverkehrszertifizierung (EN50121-3-2) und der Fahrzeugzertifizierung (E-Mark) machen den GM-1100 ideal für Mobilität Anwendungen.
Herausragende Kühlleistung
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Das innovative Design verbessert die Systemkühlung, indem es unabhängige Wärmeableitungskanäle für die CPU und GPU zur oberen Abdeckung und den Seiten des extrudierten Aluminiumgehäuses bereitstellt. In Kombination mit einem externen Lüfter bildet es eine solide Grundlage für einen stabilen und zuverlässigen Betrieb.
Robuste Sicherheit
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Die harten Anforderungen der Edge-AI-Umgebung werden durch die Unterstützung eines breiten Temperatur- (-40 bis 70 °C) und Spannungsbereichs (9 bis 48 VDC) gemeistert. Die Zertifizierung nach dem US-Militärschockstandard (MIL-STD-810H) die Stabilität und Sicherheit des Produkts.
![[ Product Spotlight ] Cincoze Embedded GPU-Computer](data/images/202412/1733730601812602319.jpg)
| Model Name | GM-1100 | |
|---|---|---|
| System | Processor | • 14th Generation Intel® Raptor Lake-S Refresh Series CPU: |
| Chipset | • Intel R680E Chipset | |
| Memory | • 2x DDR5 4800 MHz SO-DIMM Socket, Supports Un-buffered and ECC Type, Up to 64 GB | |
| BIOS | • AMI BIOS | |
| Graphics | Graphics Engine | • Integrated Intel® UHD Graphics 770: Core™ i9/i7/i5 • Integrated Intel® UHD Graphics 730: Core™ i3 • Integrated Intel® UHD Graphics 710: Pentium®/Celeron® |
| Maximum Display Output | • Supports Triple Independent Display | |
| DP | • 1x DisplayPort Connector (4096 x 2304@60Hz) *Verified maximum resolution: 3840x2160@ 60Hz | |
| HDMI | • 1x HDMI Connector (4096 x 2160@30Hz) *Verified maximum resolution: 3840x2160@ 30Hz | |
| VGA | • 1x VGA Connector (1920 x 1200 @60Hz) | |
| Audio | Audio Codec | • Realtek® ALC888, High Definition Audio |
| Line-out | • 1x Line-out, Phone Jack 3.5mm | |
| Mic-in | • 1x Mic-in, Phone Jack 3.5mm | |
| I/O | LAN | • 1x 2.5GbE LAN, RJ45 - Intel® I225 • 1x 1GbE LAN, RJ45 - Intel® I219 |
| COM | • 4x RS-232/422/485 with Auto Flow Control (Supports 5V/12V), DB9 | |
| USB | • 1x 20Gbps USB3.2 Gen2 x2, Type C • 3x 10Gbps USB3.2 Gen2 x1, Type A • 4x 5Gbps USB3.2 Gen1 x1, Type A | |
| Storage | SSD/HDD | • 2x 2.5" Front Accessible SATA HDD/SSD Bay Supporting Hot Swap Function (SATA 3.0) (Up to 15mm in Height) |
| M.2 SSD | • 1x M.2 Key M Type 2280 Socket, Support PCIe Gen4 x4 NVMe SSD or SATA SSD (SATA3.0) • 1x M.2 SSD Shared by M.2 Key B Type 3052 Socket, Support PCIe Gen 3x2 NVMe SSD or SATA SSD (SATA3.0) • 2x M.2 SSD Shared by M.2 Key B Type 2242 Socket, Support PCIe Gen 4x2 NVMe SSD or SATA SSD (SATA3.0) | |
| RAID | • Support RAID 0/1/5/10 | |
| Expansion | MXM Socket | • 1x MXM Carrier Board Socket for MXM GPU Module Expansion |
| M.2 E Key Socket | • 1x M.2 Key E Type 2230 Socket (PCIe Gen 3x2 / USB2.0), Support Wireless/Intel CNVi Module Expansion | |
| M.2 B Key Socket | • 1x M.2 Key B Type 3042/3052 Socket (PCIe Gen 3x2 / USB3.2 Gen2x1 / USB2.0 / SATA), Support 5G/Storage/Add-on Card Expansion • 2x M.2 Key B Type 2242 Socket (PCIe Gen 4x2 / USB2.0 / SATA ), Support Storage/Add-on Card Expansion | |
| SIM Socket | • 2x SIM Socket | |
| CMI (Combined Multiple I/O) Interface | • 1x High Speed CMI Interface for optional CMI Module Expansion • 1x Low Speed CMI Interface for optional CMI Module Expansion | |
| CFM (Control Function Module) Interface | • 1x CFM IGN Interface for optional CFM-IGN Module Expansion | |
| Other Function | External FAN Connector | • 2x External FAN Connector, 4-pin Terminal Block (Support Smart Fan by BIOS) |
| Power Ignition Sensing | • Support Power Ignition Sensing Function with Delay Time Management and Selectable 12V/24V (With Optional CFM Module) | |
| Clear CMOS Switch | • 1x Clear CMOS Switch | |
| Reset Button | • 1x Reset Button | |
| Instant Reboot | • Support 0.2sec Instant Reboot Technology | |
| Watchdog Timer | • Software Programmable Supports 256 Levels System Reset | |
| Antenna Holes | • 2x Antenna Holes | |
| Status LED Indicator | • HDD LED、GPIO LED、IGN LED、GPU LED、Ethernet LED | |
| Power | Power Button | • 1x ATX Power On/Off Button |
| Power Mode Switch | • 1x AT/ATX Mode Switch | |
| Power Input | • 9-48 VDC, Single Power Source Connector Type: 2x 3-pin Terminal Block, Each Terminal Block Current Limitation is 15A • Power input voltage from 9V to 23V must use dual power connectors, power input voltage from 24V to 48V can use single power connector | |
| Remote Power On/Off | • 1x Remote Power On/Off, 2-pin Terminal Block | |
| Max. Power Consumption | • 35W CPU: 187.51W • 65W CPU: 258.96W - Test conducted with CPU, 1x RAM, and 1x storage - 100% load during burn-in testing. | |
| Inrush Current (Peak) | • 35W CPU: 5.467A@24V • 65W CPU: 5.725A@24V | |
| Physical | Dimension ( W x D x H ) | • 260 x 200 x 85 mm |
| Weight Information | • 4.73 kg | |
| Mechanical Construction | • Extruded Aluminum with Heavy Duty Metal | |
| Mounting | • Wall / Side / DIN-RAIL / VESA Mount | |
| Physical Design | • Fanless Design • Cableless Design • Jumper-less Design • Unibody Design | |
| Reliability & Protection | Reverse Power Input Protection | • Yes |
| Over Voltage Protection | • Protection Range: 51~58V • Protection Type: shut down operating voltage, re-power on at the preset level to recover | |
| Over Current Protection | • 30A | |
| CMOS Battery Backup | • SuperCap Integrated for CMOS Battery Maintenance-free Operation | |
| MTBF | • 313,541 Hours - Database: Telcordia SR-332 Issue3, Method 1, Case 3 | |
| Operating System | Windows | • Windows®11, Windows®10 |
| Linux | • Ubuntu Desktop 22.04 LTS | |
| Environment | Operating Temperature | • 35W TDP Processor: -40°C to 70°C • 65W TDP Processor with external FAN: -40°C to 60°C * PassMark BurnInTest: 100% CPU, 2D/3D Graphics (without thermal throttling) * With extended temperature peripherals; Ambient with air flow * According to IEC60068-2-1, IEC60068-2-2, IEC60068-2-14 |
| Storage Temperature | • -40°C to 70°C | |
| Relative Humidity | • 95%RH @ 70°C (non-Condensing) | |
| Shock | • MIL-STD-810H | |
| Vibration | • MIL-STD-810H | |
| EMC | • CE, UKCA, FCC, ICES-003 Class A • EN 50155 (EN 50121-3-2 Only) • E-mark (Pending) | |
| EMI | • CISPR 32 Conducted & Radiated: Class A • EN/BS EN 50121-3-2 Conducted & Radiated: Class A • EN/BS EN IEC 61000-3-2 Harmonic current emissions: Class A • EN/BS EN 61000-3-3 Voltage fluctuations & flicker • FCC 47 CFR Part 15B, ICES-003 Conducted & Radiated: Class A | |
| EMS | • EN/IEC 61000-4-2 ESD: Contact: 6 kV; Air: 8 kV • EN/IEC 61000-4-3 RS: 80 MHz to 1000 MHz: 20 V/m • EN/IEC 61000-4-4 EFT: AC Power: 2 kV; Signal: 2 kV • EN/IEC 61000-4-5 Surges: AC Power: 2 kV • EN/IEC 61000-4-6 CS: 10V (**Compliant with the standard when utilizing shielded cable.) • EN/IEC 61000-4-8 PFMF: 50 Hz, 1A/m • EN/IEC 61000-4-11 Voltage Dips & Voltage Interruptions: 0.5 cycles at 50 Hz | |
| Safety | • UL, cUL , CB, IEC, EN 62368-1 | |
| Model No. | Description |
|---|---|
| GM-1100-R10 | 14/13/12th Gen Intel® Core™ Series Embedded GPU Computer, Supports 1x MXM 3.1 GPU Expansion Socket |
| GM-1100 GPU Computer x 1 | Remote Function Terminal Block Connector x1 |
| CPU Heatsink Pack x1 | External Fan Terminal Block Connector x2 |
| Screw Pack x1 | Wall Mounting Kit x1 |
| Power Terminal Block Connector x 2 | M.2 Key B Type 3052 to 3042 Adapter Bracket x1 |
| Model No. | Description |
|---|---|
| MXM-A4500-R10 | NVIDIA Embedded RTX A4500 MXM Type B, 16G, 80W Kit with Heatsink and Thermal Pad |
| MXM-A2000-R10 | NVIDIA Embedded RTX A2000 MXM Type A, 8G, 60W Kit with Heatsink and Thermal Pad |
| MXM-A1000-R10 | NVIDIA Embedded RTX A1000 MXM Type A, 4G, 60W Kit with Heatsink and Thermal Pad |
| MXM-A500-R10 | NVIDIA Embedded RTX A500 MXM Type A, 4G, 40W Kit with Heatsink and Thermal Pad |
| MXM-RTX3000-R10 | NVIDIA Quadro Embedded RTX3000 MXM Kit with Heatsink and Thermal Pad |
| MXM-T1000-R10 | NVIDIA Quadro Embedded T1000 MXM Kit with Heatsink and Thermal Pad |
| MXM-HSKA-01 | MXM Type A Heatsink Kit for MXM-A500 |
| MXM-HSKA-02 | MXM Type A Heatsink Kit for MXM-A1000 & MXM-A2000 |
| MXM-HSKA-03 | MXM Type A Heatsink Kit for MXM-T1000 |
| MXM-HSKB-01 | MXM Type B Heatsink Kit for MXM-A4500 |
| MXM-HSKB-02 | MXM Type B Heatsink Kit for MXM-RTX3000 |
| Model No. | Description |
|---|---|
| CB-DP02-R10 | Carrier Board with one MXM 3.1 interface and no DisplayPort output for MXM-A500 |
| CB-DP03-R10 | Carrier Board with 1x MXM 3.1 Interface and 4x DisplayPort Output |
| CB-DP04-R10 | Carrier Board with 1x MXM 3.1 Interface and 4x DisplayPort Output for MXM-A4500 |
| CMI-LAN01-R12 | CMI Module with 4x RJ45 Intel I210 GbE LAN Ports |
| CMI-M12LAN01-R12 | CMI Module with M12 A-Coded Connector, 4x Intel I210 GbE LAN Ports |
| CMI-XM12LAN01-R10 | CMI Module with M12 X-Coded Connector, 4x Intel I210 GbE LAN Ports |
| CMI-10GLAN01-R10 | CMI Module with 2x Intel® X550 10GbE LAN, RJ45 Port |
| CMI-DIO01 | CMI Module with 16x Optical Isolated DIO (8 in/8 out) |
| CMI-COM01 | CMI Module with 2x RS232/422/485 (Support 5V/12V) |
| CFM-PoE01 | CFM Module with PoE Control Function, Individual Port 25.5W |
| CFM-IGN01 | CFM Module with Power Ignition Sensing Control Function, 12V/24V Voltage Detection Selectable |
| UB1303 | Universal Bracket with 2x DB9 Cutout |
| UB1310 | Universal Bracket with 4x M12 Cutout |
| UB1312 | Universal Bracket with 4x RJ45 Cutout |
| UB1318 | Universal Bracket with DIO Cutout |
| UB1328 | Universal Bracket with 2x RJ45 Cutout |
| UB1329 | Universal Bracket with 4x DP |
| UB1330-R10 | Universal Bracket with 4x M12 X-Coded Cutout |
| UB0932-R10 | Universal Bracket with 3x Antenna Cutout |
| UB1332-R10 | Universal Bracket with 3x Antenna Cutout |
| FAN-EX102 | External Fan Kit with 2x 4pin Terminal Block Plug for GM Series, Support Smart Fan Function |
| SIDE-GM | GM Series side mount kit |
| DIN01 | DIN-RAIL Mount Kit, KMRH-K175 |
| GST220A24-CIN | Adapter AC/DC 24V 9.2A 220W with 3pin Terminal Block Plug 5.0mm Pitch, with TUBES, level VI |
| GST360A24-CIN | Adapter AC/DC 24V 15A 360W with 3pin Terminal Block Plug 5.0mm Pitch, with TUBES, level VI |
| RSD-200D-24 | Railway Single Output DC-DC Converter 200W / DC 24V |
| Power Cable | 1M Power Cable with 3-Pin Terminal Block Plug, Stripped and Tinned End with Tube |
| CB-DP02 (compatible with standard UB) | CB-DP03/UB1329 | CB-DP04/UB1329 | |
|---|---|---|---|
| MXM-A500 | V | ||
| MXM-A1000 | V | ||
| MXM-A2000 | V | ||
| MXM-A4500 | V | ||
| MXM-T1000 | V | ||
| MXM-RTX3000 | V |
| Betreff | Veröffentlichungsdatum | Download |
|---|---|---|
| GM-1100 Datasheet | 2024/11/18 | Download |
| Betreff | Veröffentlichungsdatum | Download |
|---|---|---|
| GM-1100 User Manual | 2025/03/19 | Download |
| Betreff | Veröffentlichungsdatum | Download |
|---|---|---|
| GM-1100 Driver - Audio | 2024/10/24 | Download |
| GM-1100 Driver - Chipset | 2024/10/24 | Download |
| GM-1100 Driver - COM | 2024/10/24 | Download |
| GM-1100 Driver - GNA | 2024/10/24 | Download |
| GM-1100 Driver - Graphics | 2025/04/29 | Download |
| GM-1100 Driver - LAN | 2024/10/24 | Download |
| GM-1100 Driver - ME | 2025/04/29 | Download |
| GM-1100 Driver - RST | 2024/10/24 | Download |