MXM-AD2000
NVIDIA Embedded RTX AD2000 MXM Type A, 8G, 60W Kit with Heatsink and Thermal Pad
PRODUCTS FEATURES
- NVIDIA® RTX™ AD2000 Embedded Graphics
- Standard MXM 3.1 Type A Form Factor (82 x 70 mm)
- 3072 NVIDIA® CUDA® Cores, 24 RT cores, and 96 Tensor cores
- 14.5 TFLOPS Peak FP32 Performance
- PCIe Gen 4 x8 interface
- 5-year Availability
OVERVIEW
MXM-AD2000 is an embedded MXM GPU module equipped with an NVIDIA RTX™ GPU based on the Ada Lovelace Architecture, using the MXM 3.1 Type A form factor. It features 3,072 CUDA® cores, 24 RT cores, and 96 Tensor cores, paired with 8 GB GDDR6 memory on a 128-bit bus. With a peak FP32 performance of approximately 14.5 TFLOPS, it's an excellent choice for high-performance edge computing, machine vision, and AI acceleration in compact embedded systems.
SPECIFICATION
| GPU | NVIDIA RTX™ 2000 ADA AD107-975 GPU |
|---|---|
| Memory | 8GB GDDR6 memory, 128-bit (Bandwidth: 256 GB/s) |
| CUDA Cores | 3072 CUDA cores, 14.5 TFLOPS peak FP32 performance |
| Tensor Cores | 96 Tensor Cores |
| RT Cores | 24 RT Cores |
| Compute API | CUDA® Toolkit 8.0 and above, CUDA® Compute version 8 and above, OpenCL™ 1.2 |
| Graphics API | DirectX® 12.1, OpenGL® 4.6 |
| Display Outputs | 3x DisplayPort 1.4a digital video outputs, 4K at 120Hz or 8K at 60Hz with 10-bit color depth |
| Interface | MXM 3.1, PCI Express Gen4 x8 support |
| Dimensions | 82 (W) x 70 (D) x 4.8 (H) mm |
| Form Factor | Standard MXM 3.1 Type A |
| Power Consumption | 60W |
| OS Support | Windows 11, Windows 10 & Linux support by project |
ORDERING INFORMATION
| Model No. | Description |
|---|---|
| MXM-AD2000-R10 | NVIDIA Embedded RTX AD2000 MXM Type A, 8G, 60W Kit with Heatsink and Thermal Pad |
| NVIDIA RTX™ Embedded AD2000 GPU Card x 1 | GPU Heatsink x 1 |
| GPU Thermal Pad Kit x 1 | Screw Pack x 1 |
| Model No. | Description |
|---|---|
| MXM-HSKA-02 | MXM Type A Heatsink Kit for MXM-A1000, MXM-A2000, and MXM-AD2000 |
* The MXM module kit includes a heat sink and thermal pads. The MXM Heat Sink Kit is intended for cases where an additional standalone heat sink and thermal pads are required.