產品介紹
MXM-AD5000 是一款嵌入式 MXM GPU 模組，搭載 NVIDIA RTX™ 5000 Ada GPU，基於 Ada Lovelace 架構，採用 MXM 3.1 Type B 尺寸規格。它擁有 9,728 個 CUDA® 核心、76 個 RT 核心與 304 個 Tensor 核心，搭配 16 GB GDDR6 記憶體，256-bit 介面，帶寬高達 576 GB/s。其 FP32 峰值運算性能可達 42.6 TFLOPS，專為 高階邊緣 AI、先進機器視覺與高效能嵌入式計算應用而設計。
詳細規格
| GPU | NVIDIA RTX™ 5000 ADA AD103-950-955 GPU |
|---|---|
| Memory | 16GB GDDR6 memory, 256-bit (Bandwidth: 576 GB/s) |
| CUDA Cores | 9728 CUDA cores, 42.6 TFLOPS peak FP32 performance |
| Tensor Cores | 304 Tensor Cores |
| RT Cores | 76 RT Cores |
| Compute API | CUDA® Toolkit 8.0 and above, CUDA® Compute version 8 and above, OpenCL™ 1.2 |
| Graphics API | DirectX® 12.1, OpenGL® 4.6 |
| Display Outputs | 4x DP 1.4a, HDMI 2.1, 4K at 120Hz or 8K at 60Hz with 10-bit color depth |
| Interface | MXM 3.1, PCI Express Gen4 x16 support |
| Dimensions | 82 (W) x 105 (D) x 4.8 (H) mm |
| Form Factor | Standard MXM 3.1 Type B |
| Power Consumption | 80W |
| OS Support | Windows 11, 10 & Linux Drivers, 64-bit |
訂購資訊
| Model No. | Description |
|---|---|
| MXM-AD5000-R10 | NVIDIA Embedded RTX AD5000 MXM Type B, 16G, 80W Kit with Heatsink and Thermal Pad |
| NVIDIA RTX™ Embedded AD5000 GPU Card x 1 | GPU Heatsink x 1 |
| GPU Thermal Pad Kit x 1 | Screw Pack x 1 |
| Model No. | Description |
|---|---|
| MXM-HSKB-03 | MXM Type B Heatsink Kit for MXM-AD3500 & MXM-AD5000 |
* The MXM module kit includes a heat sink and thermal pads. The MXM Heat Sink Kit is intended for cases where an additional standalone heat sink and thermal pads are required.