Cincoze DX-1300 High-Performance Compact Embedded Computer: Powerful Edge Computing for Space-Constrained Environments
The Cincoze Rugged Computing – DIAMOND product line’s high-performance, compact embedded computer, the DX-1300, is specifically engineered for demanding, mission-critical applications where space is at a premium. Its high performance, powerful features, and high versatility make the DX-1300 the go-to solution for edge computing tasks such as advanced image processing, AI inference, and multi-task data integration. It is widely deployed across high-barrier vertical markets, including manufacturing automation, in-vehicle systems, and railways.
Powerful Edge AI Computing Platform
The Intel® Core™ Ultra 200S processor integrates CPU, GPU, and NPU, delivering up to 36 TOPS of AI inference performance to handle complex Edge AI workloads effortlessly.
Compact Design
Measuring just 242 x 173 x 75 mm — roughly the footprint of an 11” iPad — its compact design simplifies deployment in environments with severe installation space constraints.
Comprehensive I/O Interface
A rich array of I/O options, including high-speed LAN and USB, COM, DIO, and multiple display outputs, meets the rigorous demands of equipment integration and data acquisition.
Versatile Scalability
Built-in M.2 Key B and E expansion slots, along with proprietary modular technology, enable flexible integration of wireless communication and high-speed storage, as well as further expansion of I/O and functionality.
Why Choose the Cincoze DX-1300?
High-Speed Transmission & Storage for Surveillance and Multi-Video Capture
For video capture and surveillance, transmission bandwidth, connectivity density, and storage performance are the three pillars of success. For fast data transmission, the DX-1300 provides high-speed I/O, including LAN and USB. The LAN ports support multiple specifications (10G, 2.5G, & 1G) and M12 A-code or X-code connectors, offering total flexibility. For connectivity, it supports up to 12x LAN ports or 8x PoE ports, meeting multi-camera streaming requirements while significantly reducing wiring complexity. For storage, it supports both high-capacity SATA SSDs and high-speed NVMe SSDs, balancing speed and capacity to provide a stable foundation for diverse application scenarios.
User-Centric Design for Easy Maintenance – Boosting Field Efficiency
The DX-1300’s design prioritizes on-site maintenance through thoughtful details that enhance user convenience. For easy setup and adjustment, the SIM card slots, CMOS battery, and essential setting switches are located in the front-access maintenance area, allowing for quick adjustments without disassembly. Additionally, the two front-accessible drive bays enable the rapid removal and replacement of storage devices, ensuring time-sensitive data security and seamless hardware swaps.
Certified for Multiple Market Verticals
Built with industrial-grade components and a ruggedized chassis, the DX-1300 features a single-piece top cover and a cableless, jumperless internal design. It supports a wide operating temperature range (-40°C to 60°C) and a wide voltage input (9–48V) for superior environmental resilience. Furthermore, the DX-1300 has secured key industry certifications to meet the specific regulatory requirements of different sectors:
DX-1300 High-Performance & Compact Rugged Computer
| DX-1300 | |
| Processor | Intel® Arrow Lake-S Core™ Ultra 200S Series (Max 65 W TDP) |
| Memory | 2x DDR5 SODIMM/CSODIMM Socket, Support Un-buffered and ECC Type |
| I/O | • 2x 2.5 GbE LAN, RJ45 • 4x COM with Auto Flow Control (Supports 5V/12V), DB9 • 4x 10Gbps USB 3.2 Gen2x1, Type A • 4x 5Gbps USB 3.2 Gen1x1, Type A |
| Storage | 2x 2.5” Front Accessible SATA HDD/SSD Bay ( SATA 3.0 ) |
| Expansion Socket | • 1x M.2 Key B Type 3042/3052 Socket • 1x M.2 Key B Type 2242 Socket • 1x M.2 Key E Type 2230 Socket |
| Modular Expansion | I/O: 10G / 2.5G /1 GbE LAN & COM & DIO |
| Function: Power over Ethernet (PoE), Power Ignition Sensing (IGN), Trusted Platform Module (TPM) | |
