MXM-AD5000
NVIDIA Embedded RTX AD5000 MXM Type B, 16G, 80W Kit with Heatsink and Thermal Pad
PRODUCTS FEATURES
- NVIDIA® RTX™ AD5000 Embedded Graphics
- Standard MXM 3.1 Type B Form Factor (82 x 105 mm)
- 9728 NVIDIA® CUDA® Cores, 76 RT cores, and 304 Tensor cores
- 42.6 TFLOPS Peak FP32 Performance PCIe Gen 4 x16 interface
- 5-year Availability
OVERVIEW
MXM-AD5000 is an embedded MXM GPU module powered by the NVIDIA RTX™ 5000 Ada GPU based on the Ada Lovelace architecture, utilizing the MXM 3.1 Type B form factor. It features 9,728 CUDA® cores, 76 RT cores, and 304 Tensor cores, paired with 16 GB GDDR6 memory on a 256-bit interface with up to 576 GB/s bandwidth. Delivering up to 42.6 TFLOPS of peak FP32 performance, it is designed for high-end edge AI, advanced machine vision, and high-performance computing applications in embedded systems.
SPECIFICATION
| GPU | NVIDIA RTX™ 5000 ADA AD103-950-955 GPU |
|---|---|
| Memory | 16GB GDDR6 memory, 256-bit (Bandwidth: 576 GB/s) |
| CUDA Cores | 9728 CUDA cores, 42.6 TFLOPS peak FP32 performance |
| Tensor Cores | 304 Tensor Cores |
| RT Cores | 76 RT Cores |
| Compute API | CUDA® Toolkit 8.0 and above, CUDA® Compute version 8 and above, OpenCL™ 1.2 |
| Graphics API | DirectX® 12.1, OpenGL® 4.6 |
| Display Outputs | 4x DP 1.4a, HDMI 2.1, 4K at 120Hz or 8K at 60Hz with 10-bit color depth |
| Interface | MXM 3.1, PCI Express Gen4 x16 support |
| Dimensions | 82 (W) x 105 (D) x 4.8 (H) mm |
| Form Factor | Standard MXM 3.1 Type B |
| Power Consumption | 80W |
| OS Support | Windows 11, 10 & Linux Drivers, 64-bit |
ORDERING INFORMATION
| Model No. | Description |
|---|---|
| MXM-AD5000-R10 | NVIDIA Embedded RTX AD5000 MXM Type B, 16G, 80W Kit with Heatsink and Thermal Pad |
| NVIDIA RTX™ Embedded AD5000 GPU Card x 1 | GPU Heatsink x 1 |
| GPU Thermal Pad Kit x 1 | Screw Pack x 1 |
| Model No. | Description |
|---|---|
| MXM-HSKB-03 | MXM Type B Heatsink Kit for MXM-AD3500 & MXM-AD5000 |
* The MXM module kit includes a heat sink and thermal pads. The MXM Heat Sink Kit is intended for cases where an additional standalone heat sink and thermal pads are required.