MXM-AD3500
NVIDIA Embedded RTX AD3500 MXM Type B, 12G, 80W Kit with Heatsink and Thermal Pad
PRODUCTS FEATURES
- NVIDIA® RTX™ AD3500 Embedded Graphics
- Standard MXM 3.1 Type B Form Factor (82 x 105 mm)
- 5120 NVIDIA® CUDA® Cores, 40 RT cores, and 160 Tensor cores
- 23 TFLOPS Peak FP32 Performance PCIe Gen 4 x16 interface
- 5-year Availability
OVERVIEW
MXM-AD3500 is an embedded MXM GPU module powered by the NVIDIA RTX™ 3500 Ada GPU based on the Ada Lovelace architecture, utilizing the MXM 3.1 Type B form factor. It features 5,120 CUDA® cores, 40 RT cores, and 160 Tensor cores, paired with 12 GB GDDR6 memory on a 192-bit interface with up to 432 GB/s bandwidth. Delivering up to 23 TFLOPS of peak FP32 performance, it is ideal for demanding edge AI, advanced machine vision, and high-performance computing applications in embedded systems.
SPECIFICATION
| GPU | NVIDIA RTX™ 3500 ADA AD104-925 GPU |
|---|---|
| Memory | 12GB GDDR6 memory, 192-bit (Bandwidth: 432 GB/s) |
| CUDA Cores | 5120 CUDA cores, 23 TFLOPS peak FP32 performance |
| Tensor Cores | 160 Tensor Cores |
| RT Cores | 40 RT Cores |
| Compute API | CUDA® Toolkit 8.0 and above, CUDA® Compute version 8 and above, OpenCL™ 1.2 |
| Graphics API | DirectX® 12.1, OpenGL® 4.6 |
| Display Outputs | 4x DP 1.4a, HDMI 2.1, 4K at 120Hz or 8K at 60Hz with 10-bit color depth |
| Interface | MXM 3.1, PCI Express Gen4 x16 support |
| Dimensions | 82 (W) x 105 (D) x 4.8 (H) mm |
| Form Factor | Standard MXM 3.1 Type B |
| Power Consumption | 80W |
| OS Support | Windows 11, Windows 10 & Linux support by project |
ORDERING INFORMATION
| Model No. | Description |
|---|---|
| MXM-AD3500-R10 | NVIDIA Embedded RTX AD3500 MXM Type B, 12G, 80W Kit with Heatsink and Thermal Pad |
| NVIDIA RTX™ Embedded AD3500 GPU Card x 1 | GPU Heatsink x 1 |
| GPU Thermal Pad Kit x 1 | Screw Pack x 1 |
| Model No. | Description |
|---|---|
| MXM-HSKB-03 | MXM Type B Heatsink Kit for MXM-AD3500 & MXM-AD5000 |
* The MXM module kit includes a heat sink and thermal pads. The MXM Heat Sink Kit is intended for cases where an additional standalone heat sink and thermal pads are required.